
NXP Semiconductors
PESDxS1UL series
Unidirectional ESD protection diodes
11. Soldering
1.3
0.7
R0.05 (8 × )
solder lands
0.9
0.3
(2 × )
0.4
(2 × )
0.5
(2 × )
0.6 0.7 0.8
(2 × ) (2 × ) (2 × )
solder resist
solder paste
occupied area
Dimensions in mm
sod882_fr
Reflow soldering is the only recommended soldering method.
Fig 12. Reflow soldering footprint SOD882
PESDXS1UL_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 25 October 2011
? NXP B.V. 2011. All rights reserved.
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